EEUTA1A331 Datasheet, PDF (1/3 Pages) Panasonic Semiconductor – Radial Lead Type

Radial Lead Type
Series: _TA Type: _A
■ Features
● Endurance: 125 °C 2000 h
● Heat cycle: 1000 cycle –40 °C to +125 °C
● RoHS directive compliant
Aluminum Electrolytic Capacitors/ TA
■ Specifications
Category Temp. Range
–40 °C to + 125 °C
Rated W.V. Range
10 V .DC to 63 V .DC
Nominal Cap. Range
1 µF to 4700 µF
Capacitance Tolerance
DC Leakage Current
±20 % (120 Hz/+20 °C)
I < 0.01 CV or 3 (µA) After 2 minutes (Whichever is greater)
tan δ
W.V.(V)
tan δ
10 16 25 35 50 63
(120Hz / +20 °C)
0.20 0.16 0.14 0.12 0.10 0.09
For capacitance value > 1000 µF , add 0.02 per every 1000 µF.
Endurance
After following life test with DC voltage and +125 °C±2 °C ripple current value applied (The sum
of DC and ripple peak voltage shall not exceed the rated working voltage), for 2000 hours,
when the capacitors are restored to 20 °C, the capacitors, shall meet the limits specified below.
Capacitance change ±30% of initial measured value
tan δ
< 300 % of initial specified value
DC leakage current < initial specified value
Shelf Life
After storage for 1000 hours at +125 °C±2 °C with no voltage applied and then being stabilized
at +20 °C, capacitors shall meet the limits specified in Endurance. (With voltage treatment)
■ Frequency correction factor for ripple current
W.V.
(V.DC)
Cap. (µF)
60
1 to 330
0.55
10 to 63
470 to 1000
0.70
2200 to 4700
0.75
120
0.65
0.75
0.80
Frequency (Hz)
1k
0.85
0.90
0.90
10 k
0.90
0.95
0.95
100 k
1.00
1.00
1.00
■ Dimensions in mm (not to scale)
Pressure relief
Sleeve
φd±0.05
+
–
✽L
14 min.
✽ L<16 : L±1.0
L>20 : L±2.0
(φ16҂15, φ18҂15 : L±1.5)
3 min.
φ8
φD±0.5
[mm]
φ10<
φD±0.5
Body Dia. φD
8
10
12.5
16
Lead Dia. φd
0.6
0.6
0.6
0.8
Lead space F
3.5
5.0
5.0
7.5
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
– EE102 –
(mm)
18
0.8
7.5
01 Feb. 2009