ECH-U1C104JB5 Datasheet, PDF (1/2 Pages) Panasonic Semiconductor – Stacked metallized PPS film as dielectric with simple mold-less construction

Film Chip Capacitor
Type: ECHU (B)
&ILM#HIP#APACITOR
Stacked metallized PPS film as dielectric with simple
mold-less construction
■ Features
Small in size (minimum size 2.0✕1.25mm)
85˚C, 85%RH, W.V. ✕ 1.0 for 500 hours
Applicable for both flow and reflow soldering
■Recommended Applications
Time-constant
D _Filtering
Oscillation and resonance
E _{■Explanation of Part Numbers}
D _{S 1}
2
3
4
5
6
7
8
9
10
11
12
N _{E C H U}
B
ME ^{IGN Product code}
Dielectric &
construction
OM _{DES ■Specifications}
C Category temp. range
Rated voltage
E W _{Capacitance range}
R ^{E Capacitance tolerance}
Withstand voltage
T ^{N Dissipation factor}
Insulation resistance
NO _{FOR Soldering conditions}
Rated voltage
Capacitance
Cap. Tol. Suffix Suffix
1C 16VDC
1H 50VDC
G ^±2%
J ^±5%
Tape width
5 8mm
9 12mm
–55 to +125˚C
16VDC, 50VDC
0.0001 to 0.1 µF (E12)
±2%(G), ±5%(J)
Between terminals : Rated volt. (VDC)✕175% 1 to 5s
<_{=0.6% (20˚C, 1kHz)}
16VDC : ₌^>3000MΩ (20˚C, 10VDC 60s)
50VDC : ₌^>3000MΩ (20˚C, 50VDC 60s)
Flow soldering : 260˚C max. 5sec max.
Reflow soldering : 260˚C max. and 30sec max. at more than 230˚C
(Temp. at cap. surface)
■ Construction
■Dimensions in mm (not to scale)
Element
(stacked)
Outer electrode
L ±0.2
0.35 ± 0.20
(± 0.3)
W ± 0.2
0.35 ± 0.20
To be applied
only for size
code E1 & E2
Size code L W H
J1
2.0 1.25 0.8
J2
2.0 1.25 1.0
H1
3.2 1.6 0.8
H2
3.2 1.6 1.0
H3
3.2 1.6 1.4
G1
3.2 2.5 1.0
G2
3.2 2.5 1.4
G3
3.2 2.5 2.0
E1
4.8 3.3 1.4
E2
4.8 3.3 2.0
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