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2SK3124 Datasheet, PDF (1/1 Pages) Panasonic Semiconductor – Silicon N-Channel Power F-MOS FET
Power F-MOS FETs
2SK3124
Silicon N-Channel Power F-MOS FET
s Features
q Avalanche energy capacity guaranteed
q High-speed switching
q No secondary breakdown
q High electrostatic breakdown voltage
s Applications
q High-speed switching (switching power supply)
q For high-frequency power amplification
s Absolute Maximum Ratings (TC = 25°C)
Parameter
Symbol Ratings
Unit
Drain to Source breakdown voltage VDSS
400
V
Gate to Source voltage
VGSS
±20
V
Drain current
DC
ID
Pulse
IDP
±0.5
A
±1
A
Avalanche energy capacity
EAS*
0.25
mJ
Allowable power
dissipation
TC = 25°C
PD
Ta = 25°C
10
W
1
Channel temperature
Storage temperature
Tch
150
°C
Tstg
−55 to +150
°C
* L = 2mH, IL = 0.5A, 1 pulse
s Electrical Characteristics (TC = 25°C)
Parameter
Symbol
Conditions
Drain to Source cut-off current IDSS
Gate to Source leakage current IGSS
Drain to Source breakdown voltage VDSS
Gate threshold voltage
Vth
Drain to Source ON-resistance RDS(on)
Forward transfer admittance
| Yfs |
Diode forward voltage
VDSF
Input capacitance (Common Source) Ciss
Output capacitance (Common Source) Coss
Reverse transfer capacitance (Common Source) Crss
Turn-on time (delay time)
td(on)
Rise time
tr
Fall time
tf
Turn-off time (delay time)
td(off)
Thermal resistance between channel and case Rth(ch-c)
Thermal resistance between channel and atmosphere Rth(ch-a)
VDS = 320V, VGS = 0
VGS = ±20V, VDS = 0
ID = 1mA, VGS = 0
VDS = 10V, ID = 1mA
VGS = 10V, ID = 0.1A
VDS = 10V, ID = 0.1A
IDR = 0.1A, VGS = 0
VDS = 10V, VGS = 0, f = 1MHz
VDD = 100V, ID = 0.1A
VGS = 10V, RL = 1Ω
6.5±0.1
5.3±0.1
4.35±0.1
unit: mm
2.3±0.1
0.5±0.1
0.93±0.1
1.0±0.1
0.1±0.05
0.5±0.1
2.3±0.1
4.6±0.1
0.75±0.1
1
2
3
1: Gate
2: Drain
3: Source
U Type Package
min
typ
max
Unit
10
µA
±1
µA
400
V
1
3
V
17
23
Ω
100
160
mS
−1.5
V
48
pF
10
pF
5
pF
65
ns
35
ns
40
ns
70
ns
12.5 °C/W
125
°C/W
1