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2SK3049 Datasheet, PDF (1/2 Pages) Panasonic Semiconductor – Silicon N-Channel Power F-MOS FET
Power F-MOS FETs
2SK3049
Silicon N-Channel Power F-MOS FET
s Features
q Avalanche energy capacity guaranteed
q High-speed switching
q Low ON-resistance
q No secondary breakdown
s Applications
q Contactless relay
q Diving circuit for a solenoid
q Driving circuit for a motor
q Control equipment
q Switching power supply
s Absolute Maximum Ratings (TC = 25°C)
Parameter
Symbol Ratings
Unit
Drain to Source breakdown voltage VDSS
600
V
Gate to Source voltage
VGSS
±30
V
Drain current
DC
ID
Pulse
IDP
±5
A
±10
A
Avalanche energy capacity
EAS*
62.5
mJ
Allowable power
dissipation
TC = 25°C
Ta = 25°C PD
40
W
2
Channel temperature
Storage temperature
Tch
150
°C
Tstg
−55 to +150
°C
* L = 5mH, IL = 5A, 1 pulse
s Electrical Characteristics (TC = 25°C)
Parameter
Symbol
Conditions
Drain to Source cut-off current IDSS
Gate to Source leakage current IGSS
Drain to Source breakdown voltage VDSS
Gate threshold voltage
Vth
Drain to Source ON-resistance RDS(on)
Forward transfer admittance
| Yfs |
Diode forward voltage
VDSF
Input capacitance (Common Source) Ciss
Output capacitance (Common Source) Coss
Reverse transfer capacitance (Common Source) Crss
Turn-on time (delay time)
td(on)
Rise time
tr
Turn-off time (delay time)
td(off)
Fall time
tf
VDS = 480V, VGS = 0
VGS = ±30V, VDS = 0
ID = 1mA, VGS = 0
VDS = 25V, ID = 1mA
VGS = 10V, ID = 3A
VDS = 25V, ID = 3A
IDR = 5A, VGS = 0
VDS = 20V, VGS = 0, f = 1MHz
VDD = 200V, ID = 3A
VGS = 10V, RL = 66.6Ω
9.9±0.3
unit: mm
4.6±0.2
2.9±0.2
φ3.2±0.1
1.4±0.2
1.6±0.2
0.8±0.1
2.6±0.1
0.55±0.15
2.54±0.3
1 2 3 5.08±0.5
1: Gate
2: Drain
3: Source
TO-220D Package
min
typ
max
Unit
100
µA
±1
µA
600
V
2
5
V
0.85
1.5
Ω
1.7
3.4
S
−1.6
V
1200
pF
140
pF
40
pF
20
ns
30
ns
150
ns
50
ns
1