PAM8006 Datasheet, PDF (10/15 Pages) Power Analog Micoelectronics – 10W Stereo Class-D Audio Power Amplifier

PAM8006
10W Stereo Class-D Audio Power Amplifier
Heat Dissipation in PCB design
Generally, class-D amplifiers are high efficiency
and need no heat sink. For high power ones that
has high dissipation power, the heat sink may also
not necessary if the PCB is carefully designed to
achieve good heat dissipation by the PCB itself.
Dual-Side PCB
To achieve good heat dissipation , the PCB’s
copper plate should be thicker than 0.035mm and
the copper plate on both sides of the PCB should
be utilized for heat sink.
The thermal pad on the bottom of the device
should be soldered to the plate of the PCB, and
via holes, usually 9 to 16, should be drilled in the
PCB area under the device and deposited copper
on the vias should be thick enough so that the
heat can be dissipated to the other side of the
plate. There should be no insulation mask on the
other side of the copper plate. It is better to drill
more vias on the PCB around the device if
possible.
Consideration for EMI
Filters are not required if the traces from the
amplifier to the speakers are short (<20cm). But
most applications require a ferrite bead filter as
shown in below figure. The ferrite bead filter
reduces EMI of around 1MHz and higher to meet
the FCC and CE's requirements. It is
recommended to use a ferrite bead with very low
impedances at low frequencies and high
impedance at high frequencies (above 1MHz).
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Ferrite Bead
Ferrite Bead
200pF
200pF
The EMI characteristics are as follows after
employing the ferrite bead.
Vertical Polarization
4-layer PCB
If it is 4-layer PCB, the two middle layers of
grounding and power can be employed for heat
dissipation, isolating them into serval islands to
avoid short between ground and power.
Horizontal Polarization
Power Analog Microelectronics, Inc
www.poweranalog.com
10
03/2011 Rev1.0