LSR976 Datasheet, PDF (9/11 Pages) OSRAM GmbH – Hyper CHIPLED Hyper-Bright LED

LS R976, LO R976, LY R976
Lötbedingungen
Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
IR-Reflow Lötprofil
(nach IPC 9501)
IR Reflow Soldering Profile (acc. to IPC 9501)
250
˚C
T ₂₀₀
150
100
50
2-3 K/s
T_max = 245 ˚C
T = 183 ˚C
t = 70 s
OHLA0685
2-3 K/s
0
0:00 0:30 1:00 1:30 2:00 2:30 3:00 3:30 4:00 4:30 5:00 min 5:30
t
Empfohlenes Lötpaddesign IR Reflow Löten
Recommended Solder Pad IR Reflow Soldering
1.2 (0.047)
0.9 (0.035)
1.2 (0.047)
OHAPY607
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch)
2001-02-12
9