LSQ971 Datasheet, PDF (9/13 Pages) OSRAM GmbH – Lead (Pb) Free Product - RoHS Compliant

LS Q971, LO Q971, LY Q971, LG Q971
Lötbedingungen
Soldering Conditions
IR-Reflow Lötprofil
IR Reflow Soldering Profile
250
˚C
T
200
150
100
2-3 K/s
50
Vorbehandlung nach JEDEC Level 2
Preconditioning acc. to JEDEC Level 2
(nach CECC 00802)
(acc. to CECC 00802)
T_max = 245 ˚C
OHLA0685
T = 183 ˚C
t = 70 s
2-3 K/s
0
0:00 0:30 1:00 1:30 2:00 2:30 3:00 3:30 4:00 4:30 5:00 min 5:30
t
IR-Reflow Lötprofil für bleifreies Löten
(nach J-STD-020B)
IR Reflow Soldering Profile for lead free soldering (acc. to J-STD-020B)
300
˚C
T ²⁵⁰
200
255 ˚C
240 ˚C
217 ˚C
150
100
50
0
0
Ramp Up
3 K/s (max)
25 ˚C
50
Maximum Solder Profile
Recommended Solder Profile
Minimum Solder Profile
OHLA0687
260
˚C
+0 ˚C
-5 ˚C
245 ˚C ^{±5 ˚C}
235
˚C
+5 ˚C
-0 ˚C
10 s min
30 s max
120 s max
Ramp Down
6 K/s (max)
100 s max
100
150
200
250
s 300
t
2007-10-08
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