70138 Datasheet, PDF (4/4 Pages) OSRAM GmbH – LINEARlight POWER FLEX Flexible High Light Output LED Modules

Assembly Information (continued)
3. The mounting of the module is facilitated by means of the double-sided adhesive on the back-surface of the module.
Care must be taken to provide a clean and dry mounting surface, free of oils or silicone coatings as well as dirt par-
ticles. The mounting substrate must have sufficient structural integrity. Take care to completely remove the adhesive
backing. Once the module is appropriately positioned, press on the module with about 20N/cm² (refer to application
techniques of 3M adhesive transfer tapes).
4. The minimum bending radius is 2 cm. The module may be bent over a smaller radius but only in regions of the circuit board
containing no electronic components. Such bends should be made only once and fixed in position to avoid cyclic fatigue.
5. The thermal expansion coefficient along the length of the module is 17 x 10^-6cm/cm/K. When installing in environments with
large variations in temperature (e.g. outdoor applications) and operating length of more than 2m, the use of metallic mount-
ing surfaces is necessary. Otherwise it is advisable to use an additional thicker adhesive tape to absorb the stress of any
mismatch in expansion coefficients.
6. Installation of the LINEARlight POWER FLEX must include provisions for thermal management to avoid premature failure of
the product and to obtain expected service life. Service life (i.e. lumen depreciation) is primarily a function of LED tempera-
ture, which is to be monitored on the circuit board at the designated “Tc point”. (A Tc point temperature of 40°C should be
sufficient to enable a service life of 50,000 hrs.)
7. Concerning fixture design, it is important to understand that once heat is transferred to a “heat sink”, that heat must still
be allowed to escape the “system”. A heat sink transferring the thermal energy to the inside of an enclosed cavity may ulti-
mately be of little use.
8. The fixture makers’ strategy should be to design a prototype fixture and test that fixture in an appropriate environment while
monitoring the temperature at the Tc point, which should be allowed enough time to reach thermal equilibrium. Tc point
temperature can be measured with a standard thermocouple in direct contact with the circuit board at the Tc point or by use
of ML4C Series non-reversible OMEGALABELS (www.omega.com) or equivalent.
Assembly Diagram
Wiring Diagram
“Determining the Maximum Load on a Constant Voltage Power Supply.”
As noted previously, to accurately determine maximum LED load the derating values listed in the
App. Note # LED026 must be factored in.
Reference the "Maximum Product Load" circuit requirement charts for the maximum product load per power supply.
Because of the power consumed by these controllers, an additional de-rating of the overall "maximum" load must be
factored into the above chart. To determine this de-rating (wattage) value, please reference Step 8 of the same Application
Note #LED026.
OSRAM and OPTOTRONIC are registered trademarks of OSRAM GmbH.
SYLVANIA is a registered trademark of OSRAM SYLVANIA Inc.
Specifications subject to change without notice.
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