Q65111A1684 Datasheet, PDF (16/23 Pages) OSRAM GmbH – white SMT package, colored diffused silicone resin

Version 2.0 - OS-PCN-2012-038-A
LCW JNSH.EC
Reflow Soldering Profile
Reflow-Lötprofil
Preconditioning: JEDEC Level 3 acc. to JEDEC S-STD-020-D
300
˚C
T ₂₅₀
240 ˚C
217 ˚C
t_P
200
t_L
150
t_S
100
OHA04525
T_p 245 ˚C
50
25 ˚C
0
0
50
100
150
200
250
s 300
t
Profil feature
Profil-Charakteristik
Symbol
Symbol
Pb-Free (SnAgCu) Assembly
Minimum Recommendation Maximum
Ramp-up rate to preheat*⁾
25 °C to 150 °C
2
3
Time t_S
T_Smin to T_Smax
Ramp-up rate to peak*⁾
T_Smax to T_P
t_S
60
Liquidus temperature
T_L
Time above liquidus temperature
t_L
100
120
2
3
217
80
100
Peak temperature
T_P
245
260
Time within 5 °C of the specified peak t_P
10
20
30
temperature T_P - 5 K
Ramp-down rate*
T_P to 100 °C
Time
25 °C to T_P
3
3
480
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
OHL05430
Einheit
Unit
K/s
s
K/s
°C
s
°C
s
K/s
s
2012-10-17
16