LUWJNSH.EC-BRBT-5C8E-1 Datasheet, PDF (14/18 Pages) OSRAM GmbH – Vorläufige Daten / Preliminary Data

LUW JNSH.EC
Lötbedingungen
Soldering Conditions
Reflow Lötprofil für bleifreies Löten
Reflow Soldering Profile for lead free soldering
300
˚C
T ₂₅₀
200
240 ˚C
217 ˚C
150
t_S
100
Vorbehandlung nach JEDEC Level 3
Preconditioning acc. to JEDEC Level 3
(nach J-STD-020D.01)
(acc. to J-STD-020D.01)
OHA04525
T_p 245 ˚C
t_P
t_L
50
25 ˚C
0
0
50
100
150
200
250
s 300
t
Profile Feature
Pb-Free (SnAgCu) Assembly
Ramp-up Rate to Preheat*⁾
25°C to 150°C
Recommendation
2°C / sec
Max. Ratings
3°C / sec
Time t_s from T_Smin to T_Smax
(150°C to 200°C
100s
min. 60sec max. 120sec
Ramp-up Rate to Peak*⁾
180°C to T _P
Liquidus Temperture T_L
Time t_L above T_L
Peak Temperature T_P
Time t_P within 5°C of the specified
peak temperature T_P - 5K
Ramp-down Rate*
T_P to 100°C
Time 25°C to Peak temperature
2°C / sec
80sec
245°C
20sec
3°K / sec
3°C / sec
217°C
max. 100sec
max. 260°C
min. 10sec max. 30sec
6°K / sec maximum
max. 8 min.
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation ∆T/∆t: ∆t max. 5 sec; fulfillment for the whole T-range
2011-06-09
14