LUWH9GP-KYLY-4C8E-1 Datasheet, PDF (14/24 Pages) OSRAM GmbH – SMD epoxy package with silicone lens

Version 2.1
Korrosionsfestigkeit:
Recommended Solder Pad ^{7) page 23}
Empfohlenes Lötpaddesign ^{7) Seite 23}
LUW H9GP
Test Kondition: 40°C / 90 % rh / 15 ppm H₂S /
336 h
= Besser als IEC 60068-2-43 (H₂S) [25°C / 75 %
rh / 10 ppm H₂S / 21 Tage]
= Bezogen auf das Gas (H₂S) besser als EN
60068-2-60 (method 4) [25°C / 75 % rh / 200ppb
SO₂, 200ppb NO_2,10ppb Cl₂ / 21 Tage]
Reflow soldering
Reflow-Löten
Note:
2014-07-30
For superior solder joint connectivity results we
recommend soldering under standard nitrogen
atmosphere. Package not suitable for ultra
sonic cleaning.
In case the PCB layout of the application is
intended to be used with other OSLON derivates
or in future developed OSLON derivates, the
heat sink must not be electrically connected to
anode- or cathode solder pad because of
possible chip inverted polarity.
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