LUWG5GP-GXHY-5C8E Datasheet, PDF (14/18 Pages) OSRAM GmbH – white PLCC-4 package

LUW G5GP
Lötbedingungen
Soldering Conditions
Reflow Lötprofil für bleifreies Löten
Reflow Soldering Profile for lead free soldering
300
˚C
T ₂₅₀
200
240 ˚C
217 ˚C
150
t_S
100
Vorbehandlung nach JEDEC Level 2
Preconditioning acc. to JEDEC Level 2
(nach J-STD-020D.01)
(acc. to J-STD-020D.01)
OHA04525
T_p 245 ˚C
t_P
t_L
50
25 ˚C
0
0
50
100
150
200
250
s 300
t
Profil-Charakteristik
Profile Feature
Ramp-up Rate to Preheat*⁾
25 °C to 150 °C
Symbol
Symbol
Pb-Free (SnAgCu) Assembly
Minimum Recommendation Maximum
2
3
Time t_S
T_Smin to T_Smax
t_S
60
Ramp-up Rate to Peak*⁾
T_Smax to T_P
Liquidus Temperature
T_L
Time above Liquidus temperature
t_L
100
120
2
3
217
80
100
Peak Temperature
T_P
245
260
Time within 5 °C of the specified peak t_P
10
20
30
temperature T_P - 5 K
Ramp-down Rate*
T_P to 100 °C
Time
25 °C to T_P
3
6
480
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
OHA04612
Einheit
Unit
K/s
s
K/s
°C
s
°C
s
K/s
s
2012-04-12
14