LAE67B Datasheet, PDF (12/14 Pages) OSRAM GmbH – Power TOPLED Hyper-Bright LED

Empfohlenes Lötpaddesign IR Reflow Löten
Recommended Solder Pad IR Reflow Soldering
2.6 (0.102)
1.1 (0.043)
3.3 (0.130)
3.3 (0.130)
0.4 (0.016)
LA E67B
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
Kathoden Markierung /
Cathode marking
Lötstoplack
Solder resist
Cu Fläche / 12 mm² per pad
Cu-area
OHLPY439
Maße werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
2001-07-09
12