Q65111A0238 Datasheet, PDF (11/16 Pages) OSRAM GmbH – Lead (Pb) Free Product - RoHS Compliant

Empfohlenes Lötpaddesign^{8) 9) Seite 16}
Recommended Solder Pad^{8) 9) page 16}
6 (0.236)
LSG T77K
Reflow Löten
Reflow Soldering
Padgeometrie
für verbesserte
Wärmeableitung
Paddesign
for improved
heat dissipation
Cu-Fläche > 16 mm ²
Cu-area > 16 mm ²
1.5 (0.059)
6 (0.236)
1.5 (0.059)
2.8 (0.110)
2.4 (0.094)
Lötstopplack
Solder resist
Hole in PCB
OHLPY961
2010-08-30
11