LSM670-H2L1-1 Datasheet, PDF (11/19 Pages) OSRAM GmbH – Optical Indicator

Version 1.1 (Replacement in due course)
Recommended Solder Pad ^{9) page 18}
Empfohlenes Lötpaddesign ^{9) Seite 18}
Reflow soldering
Reflow-Löten
2.8 (0.110)
0.8 (0.031)
Padgeometrie
für verbesserte
Wärmeableitung
Paddesign
for improved
heat dissipation
Cu-Fläche > 16 mm²
Cu-area > 16 mm ²
Lötstopplack
Solder resist
2.8 (0.110)
0.8 (0.031)
OHLPY978
LS M670
2013-12-05
11