LP-T776-L1M2-25-Z Datasheet, PDF (11/19 Pages) OSRAM GmbH – TOPLED RG

Version 1.0 (Replacement in due course)
Recommended Solder Pad ^{9) page 18}
Empfohlenes Lötpaddesign ^{9) Seite 18}
Reflow soldering
Reflow-Löten
LP T776
6 (0.236)
1.2 (0.047)
Padgeometrie
für verbesserte
Wärmeableitung
Paddesign
for improved
heat dissipation
Cu-Fläche > 16 mm ²
Cu-area > 16 mm ²
6 (0.236)
1.2 (0.047)
2.8 (0.110)
2.4 (0.094)
Hole on PCB
Lötstopplack
Solder resist
OHLPY977
2013-08-30
11