LB-Q39G-L2OO-35-1 Datasheet, PDF (11/15 Pages) OSRAM GmbH – Lead (Pb) Free Product - RoHS Compliant

Empfohlenes Lötpaddesign^{8) Seite 15}
Recommended Solder Pad^{8) page 15}
IR Reflow Löten
IR Reflow Soldering
0.8 (0.031) _{Copper solder pad}
LB Q39G, LT Q39G
0.8 (0.031)
0.8 (0.031)
OHAPY606
Lötbedingungen
Soldering Conditions
IR-Reflow Lötprofil für bleifreies Löten
IR Reflow Soldering Profile for lead free soldering
Vorbehandlung nach JEDEC Level 2
Preconditioning acc. to JEDEC Level 2
(nach J-STD-020B)
(acc. to J-STD-020B)
300
˚C
T ²⁵⁰
200
255 ˚C
240 ˚C
217 ˚C
150
100
50
0
0
Ramp Up
3 K/s (max)
25 ˚C
50
Maximum Solder Profile
Recommended Solder Profile
Minimum Solder Profile
OHLA0687
260
˚C
+0 ˚C
-5 ˚C
245 ˚C ^{±5 ˚C}
235
˚C
+5 ˚C
-0 ˚C
10 s min
30 s max
120 s max
Ramp Down
6 K/s (max)
100 s max
100
150
200
250
s 300
t
2007-07-09
11