LSYT67B-R2S2-1-S2T2-26 Datasheet, PDF (10/15 Pages) OSRAM GmbH – more light due to higher optical efficiency

Empfohlenes Lötpaddesign^{8) Seite 15}
Recommended Solder Pad^{8) page 15}
2.6 (0.102)
1.1 (0.043)
IR Reflow Löten
IR Reflow Soldering
3.3 (0.130)
3.3 (0.130)
0.4 (0.016)
LSY T67B
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
Empfohlenes Lötpaddesign^{8) Seite 15}
Recommended Solder Pad^{8) page 15}
Kathoden Markierung /
Cathode marking
Lötstoplack
Solder resist
Cu Fläche / 12 mm² per pad
Cu-area
OHLPY439
Wellenlöten (TTW)
TTW Soldering
6.1 (0.240)
2.8 (0.110)
3.5 (0.138)
Padgeometrie für
verbesserte Wärmeableitung
Paddesign for
improved heat dissipation
2012-11-14
2.8 (0.110) 0.5 (0.020)
7.5 (0.295)
Cu Fläche / > 12 mm² per pad
Cu-area
Lötstoplack
Solder resist
10
OHAY0583