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RS6509 Datasheet, PDF (1/10 Pages) Orister Corporation – 3A, 20V, 400KHz DC/DC Asynchronous Step‐Down Converter
RS6509
3A, 20V, 400KHz DC/DC Asynchronous Step‐Down Converter
Page No. : 1/10
General Description
The RS6509 is a high‐efficiency asynchronous step‐down DC/DC converter that can deliver up to 3A output current from
4.75V to 20V input supply. The RS6509's current mode architecture and external compensation allow the transient
response to be optimized over a wide range of loads and output capacitors. Cycle‐by‐cycle current limit provides protection
against shorted outputs and soft‐start eliminates input current surge during start‐up.
The RS6509 also provides output under voltage protection and thermal shutdown protection. The low current (<30μA)
shutdown mode provides output disconnection, enabling easy power management in battery‐powered systems.
Features
● 3A Output Current
● Up to 93% Efficiency
● Integrated 100mΩ Power MOSFET Switches
● Fixed 400KHz Frequency
● Cycle‐by‐Cycle Over Current Protection
● Thermal Shutdown function
● Wide 4.75V to 20V Operating Input Range
● Output Adjustable from 1.23V to 18V
● Programmable Under Voltage Lockout
● Available in an SOP‐8 with Exposed Pad Package
● RoHS Compliant and 100% Lead (Pb)‐Free and Green
(Halogen Free with Commercial Standard)
Applications
● PC Motherboard, Graphic Card
● LCD Monitor
● Set‐Top Boxes
● DVD‐Video Player
● Telecom Equipment
● ADSL Modem
● Printer and other Peripheral Equipment
● Microprocessor core supply
● Networking power supply
● Pre‐Regulator for Linear Regulators
● Green Electronics/Appliances
Application Circuits
INPUT
4.75V to 21V
10uF/35V C1
CERAMIC x2
OFF ON
C4
0.1uF
U1
2 IN
7
EN
SW 3
8 SS
FB 5
4 GND COMP 6
RS6509‐ADSE
C5
L1
10nF
D1
15uH
B340A
C6 (Optional)
C3
R3
5.6KΩ 8.2nF
R1
16.9KΩ 1%
OUTPUT
3.3V/3A
C2
R2
10KΩ 1%
22uF/6.3V
CERAMIC x2
This integrated circuit can be damaged by ESD. Orister Corporation recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DS‐RS6509‐07 February, 2010
www.Orister.com