OPB760 Datasheet, PDF (1/4 Pages) OPTEK Technologies – Photologic Reflective Object Sensors

Product Bulletin OPB760N
June 1996
Photologic^® Reflective Object Sensors
Types OPB760N, OPB761N, OPB762N, OPB763N
Features
• Choice of mounting configurations
• Choice of output configurations
Description
The OPB760N series of reflective
assemblies feature Photologic^®
output. This electrical output can be
specified as either TTL Totem Pole or
TTL Open Collector. Either may be
supplied with inverter or buffer output
polarity. All have the added stability of a
built-in hysteresis amplifier.
Mounting Options
OPB760N series PC board mount,
without mounting tabs
OPB760T series PC board mount, with
two mounting tabs
OPB770N series wire leads with
connector, without mounting tabs
OPB770T series wire leads with
connector, with two mounting tabs
Absolute Maximum Ratings (T_A = 25^o C unless otherwise noted)
Supply Voltage, VCC (Not to exceed 3 sec.) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 V
Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40^o C to +85^o C
Operating Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40^o C to +70^o C
Lead Soldering Temperature [1/16 inch (1.6 mm) from case for 5 sec. with soldering
iron] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240^oC⁽¹⁾
Input Diode Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mW⁽²⁾
Output Photologic^® Power Dissipation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200 mW⁽³⁾
Total Device Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300 mW⁽⁴⁾
Voltage at Output Lead (Open Collector Output) . . . . . . . . . . . . . . . . . . . . . . . . . . 35 V
Diode Forward D.C. Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 mA
Diode Reverse D.C. Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 V
Notes:
(1) RMA flux is recommended. Duration can be extended to 10 sec. max. when flow soldering.
(2) Derate linearly 2.22 mW/^o C above 25^o C.
(3) Derate linearly 4.44 mW/^o C above 25^o C.
(4) Derate linearly 6.66 mW/^o C above 25^o C.
(5) The OPB760N thru OPB763N series are terminated with .020" square leads designed for
printed circuit board mounting.
(6) Normal application would be with light source blocked, simulated by IF = 0mA.
(7) Tested at d = 0.080" from a 90% diffuse white test surface.
(8) Tested at d = 0.080", 0.150" and 0.220" from a 90% diffuse white test surface. Reference:
Eastman Kodak, Catalog #1257795.
(9) Tested at d = 0.080", 0.150" and 0.220" from a 5% diffuse black test surface.
(10) All parameters tested using pulse technique.
Optek Technology, Inc.
1215 W. Crosby Road
Carrollton, Texas 75006
11-50
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