N08L6182A Datasheet, PDF (9/10 Pages) ON Semiconductor – 8Mb Ultra-Low Power Asynchronous CMOS SRAM 512K × 16bit

N08L6182A
Ball Grid Array Package
D
A1 BALL PAD
CORNER (3)
0.20±0.05
1.10±0.10
E
1. 0.30±0.05 DIA.
K TYP
TOP VIEW
SIDE VIEW
2. SEATING PLANE - Z
0.15 Z
0.05 Z
SD
A1 BALL PAD
1. DIMENSION IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER.
CORNER
PARALLEL TO PRIMARY Z.
2. PRIMARY DATUM Z AND SEATING
PLANE ARE DEFINED BY THE
e
SPHERICAL CROWNS OF THE
SOLDER BALLS.
SE
3. A1 BALL PAD CORNER I.D. TO BE
MARKED BY INK.
J TYP
e
BOTTOM VIEW
Dimensions (mm)
D
E
8±0.10 10±0.10
SD
0.375
e = 0.75
SE
0.375
J
2.125
K
2.375
BALL
MATRIX
TYPE
FULL
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