CM1451_13 Datasheet, PDF (9/10 Pages) ON Semiconductor – LCD and Camera EMI Filter Array with ESD Protection

CM1451
PACKAGE DIMENSIONS
WLCSP20, 4.01x1.38
CASE 567CL−01
ISSUE O
D
ÈÈ ^{PIN A1}
REFERENCE
2X
0.05 C
AB
E
2X
0.05 C
TOP VIEW
ÉÉÉÉÉÉÉÉÉÉ ^{OptiGuard Option}
A2
0.05 C
A
0.05 C
NOTE 3
A1
SIDE VIEW
C
SEATING
PLANE
20X b
0.05 C A B
C
0.03 C
B
A
eD/2
eD
12 3
4 5 6 7 8 9 10 11 12
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
A1
eE
PACKAGE
OUTLINE
0.87
0.44
0.50
PITCH
20X
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM MIN MAX
A 0.56 0.72
A1 0.21 0.27
A2
0.42 REF
b 0.29 0.35
D
4.01 BSC
E
1.38 BSC
eD
0.50 BSC
eE 0.435 BSC
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