NLU3G16_16 Datasheet, PDF (8/9 Pages) ON Semiconductor – Triple Non-Inverting Buffer

NLU3G16
PACKAGE DIMENSIONS
UDFN8, 1.95x1, 0.5P
CASE 517CA
ISSUE O
D
AB
PIN ONE
REFERENCE
ÉÉÉÉ _2X
0.10 C
2X
0.10 C
TOP VIEW
0.05 C
0.05 C
SIDE VIEW
e/2
e
1
4
L1
E
A3
A
A1
C
SEATING
PLANE
7X L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.20 MM FROM TERMINAL TIP.
4. PACKAGE DIMENSIONS EXCLUSIVE OF
BURRS AND MOLD FLASH.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b 0.15 0.25
D 1.95 BSC
E 1.00 BSC
e
0.50 BSC
L 0.25 0.35
L1 0.30 0.40
RECOMMENDED
SOLDERING FOOTPRINT*
7X
0.49
8X
0.30
1.24
8
5
BOTTOM VIEW
8X b
0.10 M
0.05 M
CAB
C NOTE 3
0.54
1
PKG
OUTLINE
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
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