NLU1G07_12 Datasheet, PDF (8/10 Pages) ON Semiconductor – Single Non-Inverting Buffer with Open Drain Output

NLU1G07
PACKAGE DIMENSIONS
ULLGA6 1.0x1.0, 0.35P
CASE 613AD
ISSUE A
D
A
B
PIN ONE
ÉÉ _REFERENCE
ÉÉÉÉ _{0.10 C}
E
TOP VIEW
0.10 C
0.05 C
A
6X
0.05 C
SIDE VIEW
A1
SEATING
PLANE
C
1
L1
e
5X L NOTE 4
3
6
4
BOTTOM VIEW
6X b
0.10 C A B
0.05 C NOTE 3
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
4. A MAXIMUM OF 0.05 PULL BACK OF THE
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
MILLIMETERS
DIM MIN MAX
A −−− 0.40
A1 0.00 0.05
b 0.12 0.22
D 1.00 BSC
E 1.00 BSC
e 0.35 BSC
L 0.25 0.35
L1 0.30 0.40
MOUNTING FOOTPRINT
SOLDERMASK DEFINED*
5X
0.48
6X
0.22
1.18
1
0.53
PKG
OUTLINE
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
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