NCP1589L Datasheet, PDF (8/8 Pages) ON Semiconductor – Low Voltage Synchronous Buck Controller with Light Load Efficiency and Transient Enhancement

NCP1589L
PACKAGE DIMENSIONS
DFN10, 3x3, 0.5P
CASE 485C
ISSUE C
D
A
B
ÇÇÇÇÇÇ _{PIN 1}
ÇÇÇ ^REFERENCE
E
2X
0.15 C
TOP VIEW
2X
0.15 C
0.10 C
DETAIL B
(A3)
10X 0.08 C
SIDE VIEW
A1
EDGE OF PACKAGE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
L1
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DETAIL A
Bottom View
(Optional)
5. TERMINAL b MAY HAVE MOLD COMPOUND
MATERIAL ALONG SIDE EDGE. MOLD
FLASHING MAY NOT EXCEED 30 MICRONS
ONTO BOTTOM SURFACE OF TERMINAL b.
6. DETAILS A AND B SHOW OPTIONAL VIEWS
ÉÉÉÉÉÉ ^{MOLD CMPD}
EXPOSED Cu
A3
FOR END OF TERMINAL LEAD AT EDGE OF
PACKAGE.
7. FOR DEVICE OPN CONTAINING W OPTION,
DETAIL B ALTERNATE CONSTRUCTION IS
NOT APPLICABLE.
MILLIMETERS
DIM MIN MAX
A 0.80 1.00
A1
A1 0.00 0.05
A
SEATING
PLANE
DETAIL B
Side View
(Optional)
A3 0.20 REF
b 0.18 0.30
D 3.00 BSC
D2 2.40 2.60
C
E 3.00 BSC
E2 1.70 1.90
10X L
D2
e
1
5
DETAIL A
SOLDERING FOOTPRINT*
e 0.50 BSC
K 0.19 TYP
L 0.35 0.45
L1 0.00 0.03
2.6016
10X K
10
6
10X b
0.10 C A B _{BOTTOM VIEW}
0.05 C _{NOTE 3}
E2
2.1746
1.8508 3.3048
10X
0.5651
10X
0.3008
0.5000 PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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NCP1589L/D