CSPEMI205G Datasheet, PDF (8/9 Pages) ON Semiconductor – 3-Channel Headset Microphone EMI Filter with ESD Protection

CSPEMI205G
Mechanical Details
CSP Mechanical Specifications
The CSPEMI205G is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. For
complete information on CMD’s chip scale packaging, see the California Micro Devices CSP Package
Information document.
PACKAGE DIMENSIONS
Package
Bumps
Custom CSP
8
Millimeters
Dim
Inches
Min Nom Max Min Nom Max
A1 ^{1.385 1.430 1.475 0.0545 0.0563 0.0581}
A2 ^{1.365 1.410 1.455 0.0537 0.0555 0.0573}
B1 ^{0.495 0.500 0.505 0.0195 0.0197 0.0199}
B2 ^{0.245 0.250 0.255 0.0096 0.0098 0.0100}
B3 ^{0.430 0.435 0.440 0.0169 0.0171 0.0173}
B4 ^{0.430 0.435 0.440 0.0169 0.0171 0.0173}
C1 ^{0.165 0.215 0.265 0.0065 0.0085 0.0104}
C2 ^{0.220 0.270 0.320 0.0087 0.0106 0.0126}
D1 ^{0.561 0.605 0.649 0.0221 0.0238 0.0256}
D2 ^{0.355 0.380 0.405 0.0140 0.0150 0.0160}
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
BOTTOM VIEW
A1
C1
B1
C
B
A
12345
0.30 DIA.
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
SIDE
VIEW
D1
D2
DIMENSIONS IN MILLIMETERS
Package Dimensions for CSPEMI205G
Chip Scale Package
Rev. 3 | Page 8 of 9 | www.onsemi.com