NCL30086 Datasheet, PDF (7/28 Pages) ON Semiconductor – Controller for LED Lighting

NCL30086
Table 4. ELECTRICAL CHARACTERISTICS (Unless otherwise noted: For typical values T_J = 25°C, V_CC = 12 V, V_ZCD = 0 V,
V_CS = 0 V, V_SD = 1.5 V) For min/max values T_J = −40°C to +125°C, V_CC = 12 V)
Description
Test Condition
Symbol
Min Typ Max Unit
CONSTANT CURRENT AND POWER FACTOR CONTROL
Error amplifier current capability
V_REFX = V_REF (no dimming)
I_EA
V_REFX = 25%* V_REF
±60
mA
±240
COMP Pin Start−up Current Source
LINE FEED FORWARD
COMP pin grounded
I_{EA_STUP}
140
mA
V_VS to I_CS(offset) conversion ratio
Line feed−forward current on CS pin
Offset current maximum value
VALLEY LOCKOUT SECTION
DRV high, V_VS = 2 V
K_LFF
18
20
22
mS
I_FF
35
40
45
mA
I_offset(MAX)
80 100 120
mA
Threshold for high− line range (HL) detection
Threshold for low−line range (LL) detection
Blanking time for line range detection
FREQUENCY FOLDBACK
V_VS rising
V_VS falling
V_HL
V_LL
t_HL(blank)
2.28 2.40 2.52
V
2.18 2.30 2.42
V
15
25
35
ms
Minimum additional dead time in frequency fold-
back mode
t_FF1LL
1.4 2.0 2.6
ms
Additional dead time
Additional dead time
FAULT PROTECTION
V_REFX = 5% V_REF
V_REFX = 0% V_REF
t_FF2HL
t_FF3HL
−
40
−
ms
90
−
ms
Thermal Shutdown (Note 6)
Thermal Shutdown Hysteresis
Threshold voltage for output short circuit or aux.
winding short circuit detection
F_SW = 65 kHz
T_SHDN
130 150 170
°C
T_SHDN(HYS)
−
50
–
°C
V_ZCD(short)
0.8
1.0
1.2
V
Short circuit detection Timer
Auto−recovery timer duration
SD pin Clamp series resistor
Clamped voltage
SD pin detection level for OVP
Delay before OVP or OTP confirmation
Reference current for direct connection of an
NTC (Note 8)
V_ZCD < V_ZCD(short)
SD pin open
V_SD rising
t_OVLD
70
90 110
ms
t_recovery
3
4
5
s
R_SD(clamp)
1.6
kW
V_SD(clamp)
1.13 1.35 1.57
V
V_OVP
2.35 2.50 2.65
V
T_SD(delay)
22.5 30.0 37.5
ms
I_OTP(REF)
80
85
90
mA
Fault detection level for OTP (Note 7)
SD pin level for operation recovery after an OTP
detection
V_SD falling
V_SD rising
V_OTP(off)
0.47 0.50 0.53
V
V_OTP(on)
0.66 0.70 0.74
V
OTP blanking time when circuit starts operating
(Note 8)
t_OTP(start)
250
370
ms
SD pin voltage where thermal fold−back starts
(V_REF is decreased)
V_TF(start)
0.94 1.00 1.06
V
SD pin voltage at which thermal fold−back stops
(V_REF is clamped to V_REF50)
V_TF(stop)
0.64 0.69 0.74
V
V_TF(start) over I_OTP(REF) ratio (Note 7)
T_J = +25°C to +125°C
R_TF(start)
10.8 11.7 12.6
kW
6. Guaranteed by Design
7. A NTC is generally placed between the SD and GND pins. Parameters R_TF(start), R_TF(stop), R_OTP(off) and R_OTP(on) give the resistance the
NTC must exhibit to respectively, enter thermal foldback, stop thermal foldback, trigger the OTP limit and allow the circuit recovery after
an OTP situation.
8. At startup, when V_CC reaches V_CC(on), the controller blanks OTP for more than 250 ms to avoid detecting an OTP fault by allowing the
SD pin voltage to reach its nominal value if a filtering capacitor is connected to the SD pin.
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