MC74VHC1G50DFT1G Datasheet, PDF (7/8 Pages) ON Semiconductor – Buffer

MC74VHC1G50
PACKAGE DIMENSIONS
A
G
SC70--5/SC--88A/SOT--353
DF SUFFIX
5--LEAD PACKAGE
CASE 419A--02
ISSUE G
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A--01 OBSOLETE. NEW STANDARD
419A--02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5
4
S
--B--
12
3
D 5 PL
0.2 (0.008) M B M
N
INCHES
DIM MIN MAX
A 0.071 0.087
B 0.045 0.053
C 0.031 0.043
D 0.004 0.012
G 0.026 BSC
H ------ 0.004
J 0.004 0.010
K 0.004 0.012
N 0.008 REF
S 0.079 0.087
MILLIMETERS
MIN MAX
1.80 2.20
1.15 1.35
0.80 1.10
0.10 0.30
0.65 BSC
------ 0.10
0.10 0.25
0.10 0.30
0.20 REF
2.00 2.20
J
K
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.40
0.0157
0.65
0.025
1.9
0.0748
  _{SCALE 20:1}
mm
inches
Figure 11. SC--88A/SC70--5/SOT--353
*For additional information on our Pb--Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7