MC14174B_0008 Datasheet, PDF (7/8 Pages) ON Semiconductor – Hex Type D Flip-Flop

16
1
Z
D
e
b
0.13 (0.005) M
MC14174B
PACKAGE DIMENSIONS
SOEIAJ–16
F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 966–01
ISSUE O
9
E H_E
8
L_E
Q₁
M_
L
DETAIL P
VIEW P
A
c
A₁
0.10 (0.004)
NOTES:
ąă1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
ąă2. CONTROLLING DIMENSION: MILLIMETER.
ąă3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
ąă4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
ąă5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A
--- 2.05 --- 0.081
A_{1 0.05 0.20 0.002 0.008}
b 0.35 0.50 0.014 0.020
c 0.18 0.27 0.007 0.011
D 9.90 10.50 0.390 0.413
E 5.10 5.45 0.201 0.215
e
1.27 BSC
0.050 BSC
H_E 7.40 8.20 0.291 0.323
L 0.50 0.85 0.020 0.033
L_E 1.10 1.50 0.043 0.059
M
0 _ 10 _{_} 0 _{_} 10 _{_}
Q₁ 0.70 0.90 0.028 0.035
Z
--- 0.78 --- 0.031
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