CM1214 Datasheet, PDF (7/8 Pages) List of Unclassifed Manufacturers – 1 and 2 Channel PicoGuardTM AC Signal ESD Protector

CM1214
PACKAGE DIMENSIONS
SOT−23 3−Lead (TO−236AA)
CASE 419AH−01
ISSUE O
3X b
E1
1
e
0.05
A1
D
3
E
2
e
A
L
M
DETAIL Z
c
C
SEATING
PLANE
DETAIL Z
RECOMMENDED
SOLDERING FOOTPRINT*
3X
0.56
L2
GAUGE
PLANE
C
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSIONS D AND E1 ARE
DETERMINED AT DATUM H.
5. PIN ONE INDICATOR MUST BE LOCATED IN THE IN-
DICATED ZONE.
MILLIMETERS
DIM MIN
MAX
A 0.75
1.17
A1 0.05
0.15
b
0.30
0.50
c
0.08
0.20
D 2.80
3.05
E
2.10
2.64
E1 1.20
1.40
e
0.95 BSC
L 0.40
0.60
L2
0.25 BSC
M
0°
8°
2.74
3X
0.82
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
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