74FST3253 Datasheet, PDF (7/8 Pages) ON Semiconductor – Dual 4:1 Multiplexer/ Demultiplexer Bus Switch

74FST3253
PACKAGE DIMENSIONS
QSOP−16
QS SUFFIX
CASE 492−01
ISSUE O
−B−
−A−
R
U
Q
H x 45_
RAD.
0.013 X 0.005
DP. MAX
G
L
0.25 (0.010) M T
RAD.
0.005−0.010
TYP
P
DETAIL E
K
V
C
D 16 PL
0.25 (0.010) M T B S A S
−T−
SEATING
PLANE
J
M
MOLD PIN
MARK
N 8 PL
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. THE BOTTOM PACKAGE SHALL BE BIGGER THAN
THE TOP PACKAGE BY 4 MILS (NOTE: LEAD SIDE
ONLY). BOTTOM PACKAGE DIMENSION SHALL
FOLLOW THE DIMENSION STATED IN THIS
DRAWING.
4. PLASTIC DIMENSIONS DOES NOT INCLUDE MOLD
FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 6 MILS PER
SIDE.
5. BOTTOM EJECTOR PIN WILL INCLUDE THE
COUNTRY OF ORIGIN (COO) AND MOLD CAVITY I.D.
INCHES
DIM MIN MAX
A 0.189 0.196
B 0.150 0.157
C 0.061 0.068
D 0.008 0.012
F 0.016 0.035
G 0.025 BSC
H 0.008 0.018
J 0.0098 0.0075
K 0.004 0.010
L 0.230 0.244
M
0_ 8_
N
0_ 7_
P 0.007 0.011
Q 0.020 DIA
R 0.025 0.035
U 0.025 0.035
V
0_ 8_
MILLIMETERS
MIN MAX
4.80 4.98
3.81 3.99
1.55 1.73
0.20 0.31
0.41 0.89
0.64 BSC
0.20 0.46
0.249 0.191
0.10 0.25
5.84 6.20
0_ 8_
0_ 7_
0.18 0.28
0.51 DIA
0.64 0.89
0.64 0.89
0_ 8_
F
DETAIL E
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