74FST3126 Datasheet, PDF (7/8 Pages) ON Semiconductor – 4-Bit Bus Switch

74FST3126
PACKAGE DIMENSIONS
QSOP–16
QS SUFFIX
CASE 492–01
ISSUE O
–A–
Q
R
H x 45_
U
RAD.
0.013 X 0.005
DP. MAX
–B–
G
L
0.25 (0.010) M T
RAD.
0.005–0.010
TYP
P
DETAIL E
K
V
C
D 16 PL
0.25 (0.010) M T B S A S
–T–
SEATING
PLANE
J
M
MOLD PIN
MARK
N 8 PL
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. THE BOTTOM PACKAGE SHALL BE BIGGER
THAN THE TOP PACKAGE BY 4 MILS (NOTE:
LEAD SIDE ONLY). BOTTOM PACKAGE
DIMENSION SHALL FOLLOW THE DIMENSION
STATED IN THIS DRAWING.
4. PLASTIC DIMENSIONS DOES NOT INCLUDE
MOLD FLASH OR PROTRUSIONS. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 6 MILS
PER SIDE.
5. BOTTOM EJECTOR PIN WILL INCLUDE THE
COUNTRY OF ORIGIN (COO) AND MOLD CAVITY
I.D.
INCHES
DIM MAX MIN
A 0.189 0.196
B 0.150 0.157
C 0.061 0.068
D 0.008 0.012
F 0.016 0.035
G 0.025 BSC
H 0.008 0.018
J 0.0098 0.0075
K 0.004 0.010
L 0.230 0.244
M 0_ 8_
N
0_ 7_
P 0.007 0.011
Q 0.020 DIA
R 0.025 0.035
U 0.025 0.035
V
0_ 8_
MILLIMETERS
MAX MIN
4.80 4.98
3.81 3.99
1.55 1.73
0.20 0.31
0.41 0.89
0.64 BSC
0.20 0.46
0.249 0.191
0.10 0.25
5.84 6.20
0_ 8_
0_ 7_
0.18 0.28
0.51 DIA
0.64 0.89
0.64 0.89
0_ 8_
F
DETAIL E
http://onsemi.com
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