TCP-3056N Datasheet, PDF (6/7 Pages) ON Semiconductor – 5.6 pF Passive Tunable Integrated Circuits

TCP−3056N
PACKAGE DIMENSIONS
WLCSP12, 1.18x0.72
CASE 567KE
ISSUE O
PIN A1
REFERENCE
ÈÈ ^E
2X
0.05 C
2X
0.05 C _{TOP VIEW}
0.06 C
AB
D
10X b1
10X b
0.05 C A B
0.03 C
DETAIL A
2X b
2X b1
0.05 C A B
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM MIN MAX
A 0.590 0.639
A1 0.069 0.093
b 0.079 0.129
b1 0.044 0.094
D
1.179 BSC
E
0.722 BSC
e
0.150 BSC
e1
0.159 BSC
e2
0.300 BSC
e3
0.460 BSC
e4
0.425 BSC
A
0.03 C
0.05 C
NOTE 3
A1
SIDE VIEW
DETAIL B
C
SEATING
PLANE
e3
DETAIL A
F
E
D
C
B
e
e1
e2
A
1
2
e4
BOTTOM VIEW
DETAIL B
RECOMMENDED
SOLDERING FOOTPRINT*
0.57
2X 0.15
A1
2X
0.13
PACKAGE
OUTLINE
0.52
0.51
2X 0.75
0.59
2X
0.13
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
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