CS4172 Datasheet, PDF (6/8 Pages) Cherry Semiconductor Corporation – Single Air-Core Gauge Driver

Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
Lead Count
16 Lead PDIP
16 Lead SO Wide*
Metric
Max Min
19.69 18.67
10.50 10.10
D
English
Max Min
.775 .735
.413 .398
Thermal
Data
R_ΘJC typ
R_ΘJA typ
Plastic DIP (N); 300 mil wide
PACKAGE THERMAL DATA
16 Lead
PDIP
42
80
16 Lead
SO Wide*
18
75
°C/W
°C/W
7.11 (.280)
6.10 (.240)
3.68 (.145)
2.92 (.115)
8.26 (.325)
7.62 (.300)
1.77 (.070)
1.14 (.045)
2.54 (.100) BSC
.356 (.014)
.203 (.008)
REF: JEDEC MS-001
0.39 (.015)
MIN.
.558 (.022)
.356 (.014)
D
Some 8 and 16 lead
packages may have
1/2 lead at the end
of the package.
All specs are the same.
Surface Mount Wide Body (DW); 300 mil wide
7.60 (.299)
7.40 (.291)
10.65 (.419)
10.00 (.394)
0.51 (.020)
0.33 (.013)
2.49 (.098)
2.24 (.088)
1.27 (.050) BSC
2.65 (.104)
2.35 (.093)
1.27 (.050) 0.32 (.013)
0.40 (.016) 0.23 (.009)
REF: JEDEC MS-013
Ordering Information
Part Number
CS4172XN16
CS4172XDWF16
CS4172XDWFR16
Description
16 Lead PDIP
16 Lead SO Wide*
16 Lead SO Wide* (tape & reel)
*Internally Fused Leads
0.30 (.012)
D
0.10 (.004)
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