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PACDN009_11 Datasheet, PDF (5/7 Pages) ON Semiconductor – 5-Channel ESD Protection Array | |||
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PACDN009
the effects of the parasitic series inductance inherent in the capacitor. The breakdown voltage of the zener diode should be
slightly higher than the maximum supply voltage.
As a general rule, the ESD Protection Array should be located as close as possible to the point of entry of expected
electrostatic discharges. The power supply bypass capacitor mentioned above should be as close to the VP pin of the Protection
Array as possible, with minimum PCB trace lengths to the power supply, ground planes and between the signal input and the
ESD device to minimize stray series inductance.
Additional Information
See also ON Semiconductor Application Notes AP209, âDesign Considerations for ESD Protectionâ and AP219, âESD
Protection for USB 2.0 Systemsâ.
L2
VP
POSITIVE SUPPLY RAIL
PATH OF ESD CURRENT PULSE IESD
ÃÃÃÃÃÃÃÃÃÃÃÃ ÃÃÃÃÃÃÃÃÃÃÃÃ D1
ÃÃÃÃÃÃ ÃÃÃÃÃÃ ONE
ÃÃÃÃÃÃ ÃÃÃÃÃÃ D2
CHANNEL
OF
ÃÃÃÃÃÃÃÃÃÃÃÃ ÃÃÃÃÃÃÃÃÃÃÃÃ PACDN009
L1
CHANNEL
INPUT
20 A
LINE BEING
PROTECTED
VCL
SYSTEM OR
CIRCUITRY
BEING
PROTECTED
0A
VN
GROUND RAIL
CHASSIS GROUND
Figure 2. Application of Positive ESD Pulse between Input Channel and Ground
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