NCP6132ADMNR2G Datasheet, PDF (5/31 Pages) ON Semiconductor – Dual Output 3 Phase & 2 Phase Controller with Single SVID Interface for Desktop and Notebook CPU Applications

NCP6132A, NCP6132B
ABSOLUTE MAXIMUM RATINGS
Table 2. ELECTRICAL INFORMATION
Pin Symbol
COMP, COMPA
CSCOMP, CSCOMPA
VSN, VSNA
V_MAX
V_CC + 0.3 V
V_CC + 0.3 V
GND + 300 mV
V_MIN
−0.3 V
−0.3 V
GND – 300 mV
I_SOURCE
2 mA
2 mA
1 mA
I_SINK
2 mA
2 mA
1 mA
DIFF, DIFFA
VRDY, VRDYA
VDDPB, VCC, PVCC
V_CC + 0.3 V
V_CC + 0.3 V
6.5 V
−0.3 V
−0.3 V
−0.3 V
2 mA
N/A
N/A
2 mA
2 mA
N/A
ROSC
IOUT, IOUTA Output
V_CC + 0.3 V
TBD
−0.3 V
−0.3 V
1 mA
N/A
VRMP
+25 V
−0.3 V
SW1, SW2, SWA
28 V
−5 V
−10 V ≤ 200 ns
BST1, BST2, BSTA
34 V wrt/ GND
6.5 V wrt/ SW
−0.3 V wrt/ SW
LG1, LG2, LGA
V_CC + 0.3 V
−0.3 V
−5 V ≤ 200 ns
HG1, HG2, HGA
BST + 0.3 V
−0.3 V wrt/ SW
−2 V ≤ 200 ns wrt/ SW
All Other Pins
V_CC + 0.3 V
−0.3 V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
*All signals referenced to GND unless noted otherwise.
Table 3. THERMAL INFORMATION
Parameters
Thermal Characteristic
QFN Package (Note 1)
Operating Junction Temperature Range (Note 2)
Operating Ambient Temperature Range
Maximum Storage Temperature Range
Moisture Sensitivity Level
QFN Package
*The maximum package power dissipation must be observed.
1. JESD 51−5 (1S2P Direct−Attach Method) with 0 LFM
2. JESD 51−7 (1S2P Direct−Attach Method) with 0 LFM
Symbol
R_JA
T_J
T_STG
MSL
Typical
31
−10 to +125
−10 to +100
−40 to +150
1
Units
_C/W
_C
_C
_C
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