NBXDDA016 Datasheet, PDF (5/6 Pages) ON Semiconductor – Clock Oscillator

NBXDDA016, NBXDDB016
Table 8. RELIABILITY COMPLIANCE
Parameter
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ _Shock
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Solderability
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ^Vibration
Solvent Resistance
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ _{Thermal Shock}
ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ _{Moisture Level Sensitivity}
Standard
Mechanical
Mechanical
Mechanical
Mechanical
Environment
Environment
Method
MIL−STD−833, Method 2002, Condition B
MIL−STD−833, Method 2003
MIL−STD−833, Method 2007, Condition A
MIL−STD−202, Method 215
MIL−STD−833, Method 1011, Condition A
MSL1 260°C per IPC/JEDEC J−STD−020D
V_TT = V_DD
NBXDDB016/NBXDDA016
Driver
Device
CLK
CLK
50 W
Z = 50 W
Z = 50 W
50 W
D
Receiver
Device
D
Figure 5. Typical CML Termination for Output Driver and Device Evaluation
(See Application Note AND8173 − Termination of CML Devices)
Temperature (°C)
260
217
temp. 260°C
20 − 40 sec. max.
peak
3°C/sec. max.
ramp−up
175
150
pre−heat
reflow
6°C/sec. max.
cooling
Time
60180 sec.
60150 sec.
Figure 6. Recommended Reflow Soldering Profile
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