MMT08B310T3 Datasheet, PDF (5/6 Pages) ON Semiconductor – Thyristor Surge Protectors

MMT08B310T3
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the
total design. The footprint for the semiconductor packages
must be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
2.261
0.089
2.743
0.108
2.159
0.085
SCALE 8:1
SMB
ǒ mm Ǔ
inches
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