MCR22-006 Datasheet, PDF (5/7 Pages) ON Semiconductor – Sensitive Gate Silicon Controlled Rectifiers

MCR22−6, MCR22−8
TO−92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL
H2A
H2A
H2B
H2B
H
H4 H5
W2
T1
L1 _H1
W1 W
L
T
F1
T2
F2
P2
P2
D
P1
P
Figure 9. Device Positioning on Tape
Specification
Inches
Millimeter
Item
Symbol
Min
Max
Min
Max
Tape Feedhole Diameter
D
0.1496
0.1653
3.8
4.2
Component Lead Thickness Dimension
D2
0.015
0.020
0.38
0.51
Component Lead Pitch
F1, F2
0.0945
0.110
2.4
2.8
Bottom of Component to Seating Plane
H
.059
.156
1.5
4.0
Feedhole Location
H1
0.3346
0.3741
8.5
9.5
Deflection Left or Right
H2A
0
0.039
0
1.0
Deflection Front or Rear
H2B
0
0.051
0
1.0
Feedhole to Bottom of Component
H4
0.7086
0.768
18
19.5
Feedhole to Seating Plane
H5
0.610
0.649
15.5
16.5
Defective Unit Clipped Dimension
L
0.3346
0.433
8.5
11
Lead Wire Enclosure
L1
0.09842
−
2.5
−
Feedhole Pitch
P
0.4921
0.5079
12.5
12.9
Feedhole Center to Center Lead
P1
0.2342
0.2658
5.95
6.75
First Lead Spacing Dimension
P2
0.1397
0.1556
3.55
3.95
Adhesive Tape Thickness
T
0.06
0.08
0.15
0.20
Overall Taped Package Thickness
T1
−
0.0567
−
1.44
Carrier Strip Thickness
T2
0.014
0.027
0.35
0.65
Carrier Strip Width
W
0.6889
0.7481
17.5
19
Adhesive Tape Width
W1
0.2165
0.2841
5.5
6.3
Adhesive Tape Position
W2
.0059
0.01968
.15
0.5
NOTES:
1. Maximum alignment deviation between leads not to be greater than 0.2 mm.
2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.
3. Component lead to tape adhesion must meet the pull test requirements.
4. Maximum non−cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.
5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.
6. No more than 1 consecutive missing component is permitted.
7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.
8. Splices will not interfere with the sprocket feed holes.
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