MC74HC374A_14 Datasheet, PDF (5/7 Pages) ON Semiconductor – Octal 3-State Non-Inverting D Flip-Flop

DEVICE
UNDER
TEST
TEST POINT
OUTPUT
C_L*
MC74HC374A
TEST CIRCUITS
DEVICE
UNDER
TEST
TEST POINT
OUTPUT
1 kW
C_L*
CONNECT TO V_CC WHEN
TESTING t_PLZ AND t_PZL.
CONNECT TO GND WHEN
TESTING t_PHZ AND t_PZH.
*Includes all probe and jig capacitance
Figure 4.
*Includes all probe and jig capacitance
Figure 5.
D0
3
DQ
D1
4
DQ
D2
7
DQ
D3
8
DQ
D4
13
DQ
D5
14
DQ
D6
17
DQ
D7
18
DQ
11
Clock
Output 1
Enable
C
C
C
C
C
C
C
C
2
5
6
9
12
15
16
19
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
Figure 6. Expanded Logic Diagram
ORDERING INFORMATION
Device
Package
Shipping^†
MC74HC374ADWG
SOIC−20 WIDE
(Pb−Free)
38 Units / Rail
NLV74HC374ADWG*
SOIC−20 WIDE
(Pb−Free)
38 Units / Rail
MC74HC374ADWR2G
SOIC−20 WIDE
(Pb−Free)
1000 Tape & Reel
NLV74HC374ADWR2G*
SOIC−20 WIDE
(Pb−Free)
1000 Tape & Reel
MC74HC374ADTG
TSSOP−20
(Pb−Free)
75 Units / Rail
MC74HC374ADTR2G
TSSOP−20
(Pb−Free)
2500 Tape & Reel
NLV74HC374ADTR2G*
TSSOP−20
(Pb−Free)
2500 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
http://onsemi.com
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