LV8747TA Datasheet, PDF (5/20 Pages) Sanyo Semicon Device – PWM Constant-Current Control Stepping Motor Driver and Switching Regulator Controller

LV8747TA
Pd max – Ta
6.0
*1 With Exposed Die-Pad substrate
*2 Without Exposed Die-Pad
Four-layer substrate *1
4.85
4.0
Four-layer substrate *2
2.52
2.40
2.0
1.25
0
– 20
0
20
40
60
80
100
Ambient temperature, Ta – °C
Substrate Specifications (Substrate recommended for operation of LV8747TA)
Size
: 100mm × 100mm × 1.6mm (four-layer substrate [2S2P])
Material
: Glass epoxy
Copper wiring density : L1 = 85% / L4 = 90%
L1 : Copper wiring pattern diagram
L4 : Copper wiring pattern diagram
Cautions
1) The data for the case with the Exposed Die-Pad substrate mounted shows the values when 80% or more of the
Exposed Die-Pad is wet.
2) For the set design, employ the derating design with sufficient margin.
Stresses to be derated include the voltage, current, junction temperature, power loss, and mechanical stresses such as
vibration, impact, and tension.
Accordingly, the design must ensure these stresses to be as low or small as possible.
The guideline for ordinary derating is shown below :
(1)Maximum value 80% or less for the voltage rating
(2)Maximum value 80% or less for the current rating
(3)Maximum value 80% or less for the temperature rating
3) After the set design, be sure to verify the design with the actual product.
Confirm the solder joint state and verify also the reliability of solder joint for the Exposed Die-Pad, etc.
Any void or deterioration, if observed in the solder joint of these parts, causes deteriorated thermal conduction,
possibly resulting in thermal destruction of IC.
No.A2019-5/20