LV8716QA Datasheet, PDF (5/15 Pages) ON Semiconductor – Dual H-bridge Motor Driver

LV8716QA
Substrate Specifications (Substrate recommended for operation of LV8716QA)
Size
: 90mm × 90mm × 1.6mm (two-layer substrate )
Material
: Glass epoxy
Copper wiring density
: L1 = 85%, L2 = 90%
L1: Copper wiring pattern diagram
L2: Copper wiring pattern diagram
Cautions
1) The data for the case with the Exposed Die-Pad substrate mounted shows the values when 90% or more
of the Exposed Die-Pad is wet.
2) For the set design, employ the derating design with sufficient margin.
Stresses to be derated include the voltage, current, junction temperature, power loss, and mechanical
stresses such as vibration, impact, and tension.
Accordingly, the design must ensure these stresses to be as low or small as possible.
The guideline for ordinary derating is shown below:
(1) Maximum value 80% or less for the voltage rating
(2) Maximum value 80% or less for the current rating
(3) Maximum value 80% or less for the temperature rating
3) After the set design, be sure to verify the design with the actual product.
Confirm the solder joint state and verify also the reliability of solder joint for the Exposed Die-Pad, etc.
Any void or deterioration, if observed in the solder joint of these parts, causes deteriorated thermal
conduction, possibly resulting in thermal destruction of IC.
No.A2254-5/15