LC898217XH Datasheet, PDF (5/9 Pages) ON Semiconductor – Auto Focus (AF) Controller & Driver

LC898217XH
6. Package Dimensions
unit : mm
WLCSP10, 1.04x2.04x0.265
CASE 567TH
ISSUE O
PIN A1
REFERENCE
0.10 C
E
AB
D
TOP VIEW
A3
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
MILLIMETERS
DIM MIN NOM MAX
A 0.240 0.265 0.290
A1
0.040 REF
A3
0.025 REF
b 0.12 0.17 0.22
D 0.99 1.04 1.09
E 1.99 2.04 2.09
e
0.40 BSC
0.03 C
NOTE 3
A1
SIDE VIEW
e
10X b
0.05 M C A B
B
A
1234 5
BOTTOM VIEW
C
SEATING
PLANE
e/2
e
RECOMMENDED
SOLDERING FOOTPRINT*
1
A
PACKAGE
OUTLINE
5
0.40
PITCH
B
0.40
PITCH
10X
0.17
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
5