LC898217XC Datasheet, PDF (5/9 Pages) ON Semiconductor – Auto Focus (AF) Controller & Driver

LC898217XC
6. Package Dimensions
unit : mm
WLCSP10, 1.04x2.04
CASE 567LF
ISSUE B
PIN A1
E
REFERENCE
2X
0.05 C
2X
0.05 C
0.10 C
TOP VIEW
DETAIL A
AB
D
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE SPHERICAL
NOTE 4
BACKSIDE
CROWNS OF THE SOLDER BALLS.
4. BACKSIDE COATING IS OPTIONAL.
COATING
A3
MILLIMETERS
DIM MIN MAX
A 0.27 0.33
A1
0.04 REF
A3
0.025 REF
b 0.12 0.22
DETAIL A
D
1.04 BSC
E
2.04 BSC
e
0.40 BSC
0.08 C
NOTE 3
A1
SIDE VIEW
e
10X b
0.05 C A B
B
0.03 C
A
1234 5
BOTTOM VIEW
C
SEATING
PLANE
e/2
e
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
A1
0.40
PITCH
0.40
PITCH
10X
0.17
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
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