AX5043 Datasheet, PDF (44/47 Pages) ON Semiconductor – Advanced High Performance ASK

QFN28 PACKAGE INFORMATION
Package Outline QFN28 5 mm x 5 mm
AX5043
ON
AX5043−1
AWLYYWW
Dimension Min Typ Max Units
A
0.800 0.850 0.900 mm
NOTES:
1. JEDEC ref MO−220
2. All dimensions are in millimeters
3. Pin 1 is identified by chamfer on corner of exposed die pad
4. Package warp is 0.050 maximum
5. Coplanarity applies to the exposed pad as well as the terminal
6. AWLYYWW is the packaging lot code
7. RoHS
Figure 21. Package Outline QFN28 5 mm x 5 mm
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