NSVJ2394SA3 Datasheet, PDF (4/5 Pages) ON Semiconductor – N-Channel JFET

PACKAGE DIMENSIONS
unit : mm
NSVJ2394SA3
SC-59 / CP3
CASE 318BJ
ISSUE O
A
D
3
E1
3X L
E
1
2
e
TOP VIEW
3X b
0.10 M C A
A
A2
A1
SIDE VIEW
C
SEATING
PLANE
RECOMMENDED
SOLDERING FOOTPRINT*
3X
0.80
3X
1.00
3.40
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, PRO-
TRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS,
OR GATE BURRS SHALL NOT EXCEED 0.20 PER SIDE.
4. DIMENSIONS D AND E1 ARE MEASURED AT THE OUTERMOST
EXTREME OF THE PLASTIC BODY.
5. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.10 AND 0.20 FROM THE TIP.
3X c
MILLIMETERS
DIM MIN MAX
A 0.95 1.35
A1 0.00 0.10
A2 0.20 0.40
b 0.35 0.50
c
0.10 0.20
D 2.75 3.05
E 2.30 2.70
E1 1.35 1.65
e
0.95 BSC
L 0.35 0.75
END VIEW
GENERIC
MARKING DIAGRAM
XXX M
1
XXX = Specific Device Code
M
= Date Code
= Pb-Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
0.95
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
4