NCV7708F Datasheet, PDF (4/22 Pages) ON Semiconductor – Double Hex Driver

NCV7708F
MAXIMUM RATINGS
Power Supply Voltage (VS1, VS2)
(DC)
(AC), t < 500 ms, Ivsx > −2 A
Rating
Value
Unit
V
−0.3 to 40
−1.0
Output Pin OUTHx
(DC)
(AC – inductive clamping)
V
−0.3 to 40
−8.0
Output Pin OUTLx
(DC)
(AC), t < 500 ms, IOUTLx > −2 A
(AC Inductive Clamping)
V
−0.3 to 36
−1.0
45
Pin Voltage (Logic Input pins, SI, SCLK, CSB, SO, EN, V_CC)
−0.3 to 5.5
V
Output Current (OUTL1, OUTL2, OUTL3, OUTL4, OUTL5, OUTL6, OUTH1, OUTH2, OUTH3, OUTH4,
A
OUTH5, OUTH6)
(DC) Vds = 12 V
(DC) Vds = 20 V
(DC) Vds = 40 V
(AC) Vds = 12 V, (50 ms pulse, 1 s period)
(AC) Vds = 20 V, (50 ms pulse, 1 s period)
(AC) Vds = 40 V, (50 ms pulse, 1 s period)
−1.5 to 1.5
−0.7 to 0.7
−0.25 to 0.25
−2.0 to 2.0
−0.9 to 0.9
−0.3 to 0.3
Electrostatic Discharge, Human Body Model, VS1, VS2, OUTx (Note 1)
4.0
kV
Electrostatic Discharge, Human Body Model, all other pins
2.0
kV
Electrostatic Discharge, Machine Model
200
V
Electrostatic Discharge, Charged Device Model
Operating Junction Temperature
Storage Temperature Range
Moisture Sensitivity Level
1.0
kV
−40 to 150
°C
−55 to 150
°C
SOIC−28
MSL 3
−
SSOP−24 EPAD
MSL 2
Peak Reflow Soldering Temperature: Pb−Free, 60 to 150 seconds at 217°C (Note 2)
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Tested with a VS1/VS2 power supply common point.
2. For additional information, please see or download the ON Semiconductor Soldering and Mounting Techniques Reference Manual,
SOLDERRM/D.
THERMAL CONDITIONS
Test Conditions, Typical Value
SOIC−28
Thermal Parameters
Board Details (Note 3)
Board Details (Note 4) Unit
Junction−to−Lead (psi−JL8, Y_JL8) or Pins 6−9, 20−23
10
Junction−to−Ambient (R_qJA, q_JA)
78
SSOP−24 EPAD
Junction−to−Board (R_YB)
−
Junction−to−Ambient (R_qJA)
−
Junction−to−Lead (R_YJL)
−
3. 1−oz copper, 240 mm² copper area, 0.062″ thick FR4. This is the minimum pad board size.
4. 1−oz copper, 986 mm² copper area, 0.062″ thick FR4.
11
°C/W
63
°C/W
2
°C/W
54
°C/W
7
°C/W
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