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MC74VHC541_14 Datasheet, PDF (4/6 Pages) ON Semiconductor – Octal Bus Buffer
DEVICE
UNDER
TEST
TEST
POINT
OUTPUT
CL*
*Includes all probe and jig capacitance
Figure 4.
MC74VHC541
TEST CIRCUITS
DEVICE
UNDER
TEST
TEST
POINT
OUTPUT
1kW
CL*
CONNECT TO VCC WHEN
TESTING tPLZ AND tPZL.
CONNECT TO GND WHEN
TESTING tPHZ AND tPZH.
*Includes all probe and jig capacitance
Figure 5.
INPUT
Figure 6. Input Equivalent Circuit
ORDERING INFORMATION
Device
MC74VHC541DWR2G
Package
SOIC−20WB
(Pb−Free)
Shipping†
1000 / Tape & Reel
MC74VHC541DTG
TSSOP−20
(Pb−Free)
75 Units / Rail
MC74VHC541DTR2G
TSSOP−20
(Pb−Free)
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MARKING DIAGRAMS
SOIC−20WB
20
VHC541
AWLYYWWG
1
TSSOP−20
20
VHC
541
ALYWG
G
1
A
= Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G or G = Pb−Free Package
(Note: Microdot may be in either location)
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