MC74VHC138 Datasheet, PDF (4/8 Pages) Motorola, Inc – 3-to-8 Line Decoder

MC74VHC138
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
V_CC DC Supply Voltage
– 0.5 to + 7.0
V
V_in DC Input Voltage
– 0.5 to + 7.0
V
V_out DC Output Voltage
– 0.5 to V_CC + 0.5 V
I_IK Input Diode Current
-- 20
mA
I_OK Output Diode Current
± 20
mA
I_out DC Output Current, per Pin
± 25
mA
I_CC DC Supply Current, V_CC and GND Pins
± 75
mA
P_D Power Dissipation in Still Air,
SOIC Packages†
500
mW
TSSOP Package†
450
T_stg Storage Temperature
– 65 to + 150
_C
* Absolute maximum continuous ratings are those values beyond which damage to the device
may occur. Exposure to these conditions or conditions beyond those indicated may
adversely affect device reliability. Functional operation under absolute--maximum--rated
conditions is not implied.
†Derating — SOIC Packages: – 7 mW/_C from 65_ to 125_C
TSSOP Package: -- 6.1 mW/_C from 65_ to 125_C
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min Max Unit
V_CC DC Supply Voltage
V_in
DC Input Voltage
V_out DC Output Voltage
T_A
Operating Temperature
t_r, t_f
Input Rise and Fall Time
2.0 5.5 V
0
5.5 V
0
V_CC
V
-- 55 + 125 _C
V_CC = 3.3V ±0.3V 0
V_CC =5.0V ±0.5V 0
100 ns/V
20
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high--impedance cir-
cuit. For proper operation, V_in and
V_out should be constrained to the
range GND ≤ (V_in or V_out) ≤ V_CC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or V_CC).
Unused outputs must be left open.
The θ_JA of the package is equal to 1/Derating. Higher junction temperatures may affect the expected lifetime of the device per the table and
figure below.
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature °C
80
90
100
110
120
130
140
Time, Hours
1,032,200
419,300
178,700
79,600
37,000
17,800
8,900
Time, Years
117.8
47.9
20.4
9.4
4.2
2.0
1.0
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
1
1
10
100
1000
TIME, YEARS
Figure 1. Failure Rate vs. Time
Junction Temperature
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