LC898214XC Datasheet, PDF (4/9 Pages) ON Semiconductor – AF Controller

LC898214XC
Package Dimensions
unit : mm
WLCSP8, 1.15x2.37, 0.5P
CASE 567JT
ISSUE A
PIN A1
REFERENCE
2X
0.10 C
2X
0.10 C
0.10 C
0.08 C
NOTE 3
E
AB
D
TOP VIEW
A1
SIDE VIEW
A2
A
C
SEATING
PLANE
e
B
e/2
e/2
e
A
123 4
BOTTOM VIEW
8X b
0.05 C A B
0.03 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM MIN MAX
A 0.35 0.45
A1 0.045 0.115
b 0.20 0.30
D 1.12 1.18
E 2.34 2.40
e
0.50 BSC
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
A1
0.50
PITCH
8X
0.25
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
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